mobile devices
相关结果约144841条
声表面波器件2024
本资料介绍了KYOCERA的SAW（声表面波）器件产品线，包括SAW滤波器、SAW双工器和SAW四工器。产品规格涵盖不同尺寸和频率范围，适用于移动通信、GNSS、短距离通信和基站等应用。资料还提供了产品使用注意事项，包括操作、存储、运输和安装方面的安全指南。
KYOCERA - MOBILE,双工器,四路复用器,声表面波四路复用器,声表面波滤波器,过滤器,SAW双工器,DUPLEXER,FILTER,QUADPLEXER,SAW DUPLEXER,SAW FILTER,SAW QUADPLEXER,SF15 SERIES,SF25-2140R9UUA1,SD25-1842R9UUA1,SQ25,SD16-1880R8UUA1,SF25-0725R9UUA1,SF14-2593M5UUB1,SD18-2535R8UUC1,SD18-1950R8UUQ1,SF11-2595B5UUA1,SF14,全球导航卫星系统,基站,小型基站,手机,短程通信,BASE STATION,GNSS,SHORT RANGE COMMUNICATION,SMALL CELL
紧凑型集成超低功耗6轴数字组合传感器是移动设备的理想选择6轴数字加速度计陀螺仪组合传感器KXG03、KXG07、KXG08
本资料介绍了适用于移动设备的紧凑型低功耗6轴数字组合传感器，包括KXG03、KXG07和KXG08型号。这些传感器集成了加速度计和陀螺仪功能，旨在提供高精度运动检测和数据采集。
ROHM - SMARTPHONES AND OTHER MOBILE DEVICES,六轴数字加速度计陀螺仪组合传感器,6-AXIS DIGITAL ACCELEROMETER-GYROSCOPE COMBO SENSORS,KXG03,KXG07,KXG08,健康与健身,智能手机和其他移动设备,游戏控制器，无人机, DRONES,GAMING CONTROLLERS,HEALTH AND FITNESS
发布时间 : 2025-03-03
NEXT Biometrics Active Thermal FAP20 Fingerprint Sensor Help Credence ID Expand High-End Product Line with Lower Cost Devices
Credence ID, a US based leader in global mobile biometrics and credential reading devices, wanted to expand its existing high-end Android product line to include a set of lower cost devices for developing markets in Africa, Latin America and South East Asia that require FAP 20 sized sensors.
I940-8904-G02-XX 940nm双结VCSEL泛光照明模块光电器件
该资料介绍了Coherent公司生产的940 nm双结VCSEL flood illumination模块，适用于多种光学3D传感应用。这些模块具有超紧凑的设计，低剖面和高功率输出，适用于消费电子或汽车应用。产品具备AEC-Q102认证，提供窄或宽照明场，并包含监控光电二极管。
COHERENT - OPTOELECTRONIC DEVICES,MOBILE,光电器件,双结VCSEL泛光照明模块,多模双结高功率VCSEL照明模块,多模高功率VCSEL照明器模块,DOUBLE-JUNCTION VCSEL FLOOD ILLUMINATION MODULE,MULTI-MODE DOUBLE-JUNCTION HIGH POWER VCSEL ILLUMINATION MODULE,MULTIMODE HIGH POWER VCSEL ILLUMINATOR MODULES,I940-8904-G02-XX,I940-8904-G02-01,三维传感,占用监控系统,奥姆斯,工业,应收账,手势识别,手机,汽车应用,虚拟现实,驾驶监控系统,高容量消费者,光学3D传感应用,3D SENSING,AR,AUTOMOTIVE APPLICATIONS,DMS,DRIVING MONITORING SYSTEMS,GESTURE RECOGNITION,HIGH VOLUME CONSUMER,INDUSTRIAL,OCCUPANCY MONITORING SYSTEMS,OMS,OPTICAL 3D SENSING APPLICATIONS,VR
Kinghelm Type-C Female Connector KH-TYPE-C-16P-T with Horizontal Mounting, Enabling Efficient Data Transfer and Charging Functions
The application fields of KH-TYPE-C-16P-T mainly include various electronic devices such as mobile phones, tablets, and laptops. It can achieve high-speed data transfer and fast charging functions, improving the efficiency and convenience of device use.
OMNIVISION Integrated Mini Camera Module for Mobile Phones and Other Portable Digital Devices
OMNIVISION Technologies, Inc. (Nasdaq: OVTI), a leader in designing, developing and marketing advanced, highly integrated CMOS image sensors used in electronic cameras and other optical imaging devices, today announced its OmniStar Cam, a low-power, highly integrated miniature camera module targeted at 2 Gigahertz(G), 2.5G and 3G mobile phones and other portable digital devices such as personal digital assistants (PDAs). The new camera module, based on OMNIVISION’s CIF (352×288) resolution, highly integrated CMOS image sensor, is small in size and has low power consumption.
Fujitsu Launches the FWM7BLZ23: a New Bluetooth low energy module with Large Memory of 1024KB Flush and 256KB RAM
The FWM7BLZ23 Low Energy Bluetooth Module has been developed for use in various remote and app controlled electronic products such as smart lock systems, mobile printers, water heaters, wearable devices and various other wireless devices.
Alliance Memory New 2Gb, 4Gb, 8Gb, and 16Gb LPDDR4X SDRAMs Combine Low-Voltage Operation of 0.6V With Fast Clock Speeds to 1.86GHz, Offering 50% Reduction in Power Consumption
Alliance Memory announced that it has expanded its offering of high-speed CMOS mobile low-power SDRAMs with four new LPDDR4X devices in a variety of densities. The 2Gb, 4Gb, 8Gb, and 16Gb LPDDR4X SDRAMs combine low-voltage operation of 0.6V with fast clock speeds to 1.86GHz.
Thermally Conductive Materials For Mobile communications infrastructure (5G/4G/3G)
Compared with 4G, 5G has the requirements of ultra-high speed rate, ultra-low latency, and ultra-wide connection, which needs to be paired with higher performance processors and specialised integrated circuits to enhance the data transmission performance, while the AAU and BBU work with high power consumption and increased heat dissipation. If the internal temperature of the base station is too high, it will affect the normal operation of internal devices, and then cause network instability.
Kelvin Probes Provide First-Class Performance for High-volume Final Test of Standard Array and Wafer-level Devices
Smiths Interconnect announces the introduction of an innovative spring probe contact technology for Kelvin test of packaged devices down to 0.35mm pitch.
The lithium battery protection IC HKT4056E Produced by Hottech can be Used for a Single Lithium ion Battery
HKT HKT4056E lithium battery protection IC has excellent product performance, and the product is stable and reliable. It can be used in mobile phones, Bluetooth devices, charging devices, charging stands, and wearable products.
SEMITEC‘s Smaller,Lighter Temperature Sensors for Diverse Mobile Devices
SEMITEC‘s JT thermistors are ultra-thin with a maximum thickness of 500μm and feature sufficient electrical insulation to acquire the UL safety standard. Their small, space-saving design allows mounting on devices that couldn‘t measure temperatures until now. SEMITEC‘s JT thermistors help protect people‘s lives and contribute to the diversification of mobile devices.
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